München | Vor Ort | Vollzeit

Principal Engineer Power Device CAD (f/m/div)

Your Role

Key responsibilities in your new role

  • Execute and implement automation ideas, bringing concepts into usable tools and methodologies for the team
  • Collaborate with frontend and backend analog designers to capture requirements, define frameworks, improve flows, and provide support and training
  • Design, implement, and maintain Python libraries, CLI tools, and interfaces to CAD tools (e.g., Cadence Spectre, Mentor Calibre) to automate analog design flows
  • Integrate with HPC schedulers and server farms (LSF) to enable scheduled runs, caching, reproducibility, and optimize throughput
  • Develop and integrate new methods, tools, and features into the physical design automation flow, and improve existing software modules through refactoring, testing, and maintenance
  • Build and maintain interfaces for job preparation, submission, monitoring, and results collection, ensuring seamless workflow execution
  • Create and maintain technical documentation, adhering to quality assurance processes to ensure high-quality deliverables

Your Profile

Qualifications and skills to help you succeed

  • A degree in Electrical Engineering, Computer Science, or Physics, with at least 7 years of experience in the semiconductor industry
  • EDA engineer with strong software background, specifically in Cadence EDA tool suite (Virtuoso ADE, Calibre, Spectre, etc.). Physical design knowledge is a plus
  • Expert-level Python programmer (7+ years) with strong software engineering fundamentals, including clean architecture, modular design, testing, and performance profiling
  • Experienced in Unix/Linux, data management (Perforce, Gitlab), and version control, with knowledge of software modules, object-oriented programming, and agile software development
  • Strong technical skills, including Cadence Skill coding, pcell coding, tcl/tk coding, and experience with electrical simulation tools (e.g. EMI, electro thermals)
  • Excellent problem-solving skills, with the ability to work in a dynamic environment, take leadership, and define clear architectures and requirements
  • Strong communication and collaboration skills, with experience working with cross-functional teams, including engineering teams and senior management, and ability to unify device modeling, application, and chip design
  • Fluent in English. German skills are a plus